一、覆銅板是什么東西什么材料
覆銅板是將(jiang)電子玻纖布或其它(ta)增強材料浸以樹脂,一面或雙面覆以銅(tong)箔并經(jing)熱壓而制成(cheng)的一種板(ban)狀材料,被(bei)稱(cheng)為覆銅(tong)箔層壓板(ban)(Copper Clad Laminate,CCL),簡稱(cheng)為覆銅(tong)板(ban)。各種不(bu)同(tong)形式、不(bu)同(tong)功能的印制電路(lu)板(ban),都(dou)是在覆銅(tong)板(ban)上有選擇地進行加工(gong)、蝕(shi)刻(ke)、鉆孔及(ji)鍍銅(tong)等(deng)工(gong)序(xu),制成(cheng)不(bu)同(tong)的印制電路(lu)。
覆(fu)(fu)銅(tong)板作為(wei)印(yin)制(zhi)電路(lu)板制(zhi)造中(zhong)(zhong)(zhong)的基板材料(liao),對印(yin)制(zhi)電路(lu)板主要起互連導通、絕緣和(he)支撐(cheng)的作用,對電路(lu)中(zhong)(zhong)(zhong)信號的傳輸速度、能量損失和(he)特性阻(zu)抗(kang)等有很大的影響,因此,印(yin)制(zhi)電路(lu)板的性能、品質、制(zhi)造中(zhong)(zhong)(zhong)的加工性、制(zhi)造水平、制(zhi)造成本以及長期的可靠性及穩定性在很大程(cheng)度上取決于覆(fu)(fu)銅(tong)板。
二、覆銅板和pcb板的區別
PCB也就是印制電路板,別稱(cheng)印刷線(xian)路板,PCB是電(dian)(dian)子元器件的(de)支(zhi)撐體,同時PCB也是電(dian)(dian)子元器件電(dian)(dian)氣連接的(de)載體。PCB能夠提(ti)供各元器件固定裝(zhuang)配械支(zhi)撐,實現電(dian)(dian)子元器件之(zhi)間(jian)的(de)布(bu)線(xian)、電(dian)(dian)氣連接和電(dian)(dian)絕緣。
覆銅(tong)板(ban)(ban)(ban)(ban)全名(ming)覆銅(tong)箔層壓板(ban)(ban)(ban)(ban),簡稱為(wei)CCL。覆銅(tong)板(ban)(ban)(ban)(ban)是在印(yin)制電路(lu)板(ban)(ban)(ban)(ban)制造中的基板(ban)(ban)(ban)(ban)材料,PCB的各項性(xing)能在很(hen)大程度(du)上取(qu)決于覆銅(tong)板(ban)(ban)(ban)(ban)。
PCB并不是覆銅板。覆銅板是在膠質板的一面(mian)或者雙面(mian)覆(fu)有銅(tong)箔的板材,覆(fu)銅(tong)板是制(zhi)作(zuo)單面(mian)或者雙面(mian)PCB的材料。PCB是將電路(lu)的布(bu)局布(bu)線圖印制(zhi)在覆(fu)銅(tong)板上,然后(hou)經過各種(zhong)工藝后(hou)的電路(lu)板。
值得一提的(de)(de)是(shi),PCB除了單面和雙(shuang)面之外,還(huan)有4層(ceng)(ceng)、6層(ceng)(ceng)、8層(ceng)(ceng)、10層(ceng)(ceng)的(de)(de)。