一、半導體設備的基本原理和工作方式

半導(dao)(dao)體(ti)設備工(gong)作原(yuan)理(li)基于能(neng)帶理(li)論，即在(zai)(zai)半導(dao)(dao)體(ti)中(zhong)存在(zai)(zai)價(jia)帶和導(dao)(dao)帶，其(qi)中(zhong)價(jia)帶是(shi)半導(dao)(dao)體(ti)材料中(zhong)的原(yuan)子，而導(dao)(dao)帶中(zhong)的原(yuan)子在(zai)(zai)半導(dao)(dao)體(ti)中(zhong)被(bei)加熱(re)或激發(fa)后被(bei)激發(fa)到價(jia)帶之外。當外部(bu)電荷作用于半導(dao)(dao)體(ti)中(zhong)時，它可以改變電子在(zai)(zai)能(neng)帶中(zhong)的分布，導(dao)(dao)致電導(dao)(dao)率(lv)的變化。

半導體設備具有重要的電子功能(neng)，如場效應管(guan)、整流器、功率(lv)放大器和發光二極管(guan)。基于(yu)不(bu)同應用需(xu)要，半導體設備可(ke)以通過材料、結構(gou)、工藝(yi)等方面做(zuo)出(chu)不(bu)同的改進和針對(dui)性(xing)設計。

二、半導體設備核心部件是什么

據(ju)統(tong)(tong)(tong)(tong)計，半(ban)導體設備(bei)的關(guan)(guan)鍵子系(xi)(xi)(xi)(xi)(xi)統(tong)(tong)(tong)(tong)主要(yao)分為 8 大類。包含(han)：氣液流量控 制系(xi)(xi)(xi)(xi)(xi)統(tong)(tong)(tong)(tong)、真空系(xi)(xi)(xi)(xi)(xi)統(tong)(tong)(tong)(tong)、制程診斷系(xi)(xi)(xi)(xi)(xi)統(tong)(tong)(tong)(tong)、光學系(xi)(xi)(xi)(xi)(xi)統(tong)(tong)(tong)(tong)、電源(yuan)及氣體反應系(xi)(xi)(xi)(xi)(xi)統(tong)(tong)(tong)(tong)、熱管理(li)系(xi)(xi)(xi)(xi)(xi)統(tong)(tong)(tong)(tong)、晶圓傳送系(xi)(xi)(xi)(xi)(xi) 統(tong)(tong)(tong)(tong)、其他集成(cheng)系(xi)(xi)(xi)(xi)(xi)統(tong)(tong)(tong)(tong)及關(guan)(guan)鍵組件，每個(ge)子系(xi)(xi)(xi)(xi)(xi)統(tong)(tong)(tong)(tong)亦由數量龐大的零部件組合而(er)成(cheng)。

不同(tong)半導體設備的核(he)心零部件有(you)所不同(tong)。例如(ru)：光刻機的核(he)心零部件包括工(gong)作臺(tai)、投影物鏡(jing)、光源(yuan) 等(deng)，而(er)等(deng)離子(zi)體真(zhen)空設備（PVD、CVD、刻蝕(shi)）的核(he)心零部件包括 MFC、射頻電源(yuan)、真(zhen)空泵(beng)、ESC 等(deng)。