一、覆銅板是什么

覆(fu)(fu)銅(tong)(tong)板(ban)(ban)是將電子玻(bo)纖布或其它增(zeng)強材(cai)(cai)料浸(jin)以樹脂(zhi)，一面(mian)或雙面(mian)覆(fu)(fu)以銅(tong)(tong)箔并經熱壓而(er)制(zhi)成的(de)一種板(ban)(ban)狀材(cai)(cai)料，被稱為覆(fu)(fu)銅(tong)(tong)箔層壓板(ban)(ban)（Copper Clad Laminate，CCL），簡稱為覆(fu)(fu)銅(tong)(tong)板(ban)(ban)。各種不(bu)(bu)同形式、不(bu)(bu)同功能的(de)印制(zhi)電路(lu)板(ban)(ban)，都是在覆(fu)(fu)銅(tong)(tong)板(ban)(ban)上有選擇地進行加工、蝕刻、鉆孔及鍍銅(tong)(tong)等工序，制(zhi)成不(bu)(bu)同的(de)印制(zhi)電路(lu)。

覆(fu)銅(tong)板(ban)(ban)作為印制(zhi)電(dian)(dian)路板(ban)(ban)制(zhi)造(zao)中的(de)(de)基板(ban)(ban)材料，對印制(zhi)電(dian)(dian)路板(ban)(ban)主要起(qi)互連導通、絕緣(yuan)和支撐(cheng)的(de)(de)作用，對電(dian)(dian)路中信(xin)號的(de)(de)傳輸速(su)度(du)、能量(liang)損(sun)失(shi)和特性(xing)阻抗等(deng)有很大的(de)(de)影響，因(yin)此(ci)，印制(zhi)電(dian)(dian)路板(ban)(ban)的(de)(de)性(xing)能、品質、制(zhi)造(zao)中的(de)(de)加工性(xing)、制(zhi)造(zao)水平(ping)、制(zhi)造(zao)成本以及長期的(de)(de)可靠性(xing)及穩定性(xing)在很大程(cheng)度(du)上取決于覆(fu)銅(tong)板(ban)(ban)。

二、覆銅板和pcb板的區別

PCB也就是印制電(dian)(dian)路板，別稱印刷線(xian)路板，PCB是電(dian)(dian)子(zi)元(yuan)器件(jian)的支(zhi)撐(cheng)體，同時PCB也是電(dian)(dian)子(zi)元(yuan)器件(jian)電(dian)(dian)氣連(lian)接的載體。PCB能夠提供各元(yuan)器件(jian)固定裝配械支(zhi)撐(cheng)，實現(xian)電(dian)(dian)子(zi)元(yuan)器件(jian)之間(jian)的布線(xian)、電(dian)(dian)氣連(lian)接和電(dian)(dian)絕緣。

覆銅(tong)板(ban)(ban)全名(ming)覆銅(tong)箔(bo)層壓板(ban)(ban)，簡(jian)稱為CCL。覆銅(tong)板(ban)(ban)是在印制(zhi)電(dian)路板(ban)(ban)制(zhi)造中的基板(ban)(ban)材(cai)料，PCB的各(ge)項性能在很大(da)程度上取決于覆銅(tong)板(ban)(ban)。

PCB并不是覆銅板。品牌覆銅板是(shi)在(zai)膠(jiao)質板(ban)(ban)的一(yi)面或者雙面覆(fu)(fu)有銅(tong)(tong)箔(bo)的板(ban)(ban)材(cai)，覆(fu)(fu)銅(tong)(tong)板(ban)(ban)是(shi)制(zhi)作單面或者雙面PCB的材(cai)料。PCB是(shi)將電(dian)路(lu)的布局布線圖印制(zhi)在(zai)覆(fu)(fu)銅(tong)(tong)板(ban)(ban)上，然后經(jing)過各種工藝后的電(dian)路(lu)板(ban)(ban)。

值得一提(ti)的(de)是，PCB除(chu)了單面和雙面之(zhi)外，還有4層(ceng)、6層(ceng)、8層(ceng)、10層(ceng)的(de)。