一、覆銅板是什么

覆(fu)(fu)(fu)銅(tong)(tong)板(ban)(ban)是將電(dian)子玻纖(xian)布(bu)或其它增強材料(liao)浸以樹脂(zhi)，一(yi)面(mian)或雙(shuang)面(mian)覆(fu)(fu)(fu)以銅(tong)(tong)箔(bo)并經(jing)熱壓(ya)(ya)而制(zhi)(zhi)成的一(yi)種板(ban)(ban)狀材料(liao)，被稱(cheng)(cheng)為(wei)覆(fu)(fu)(fu)銅(tong)(tong)箔(bo)層壓(ya)(ya)板(ban)(ban)（Copper Clad Laminate，CCL），簡(jian)稱(cheng)(cheng)為(wei)覆(fu)(fu)(fu)銅(tong)(tong)板(ban)(ban)。各種不同(tong)形式、不同(tong)功能的印制(zhi)(zhi)電(dian)路(lu)板(ban)(ban)，都是在覆(fu)(fu)(fu)銅(tong)(tong)板(ban)(ban)上有選擇地(di)進(jin)行加工、蝕刻、鉆孔及鍍(du)銅(tong)(tong)等工序，制(zhi)(zhi)成不同(tong)的印制(zhi)(zhi)電(dian)路(lu)。

覆銅板(ban)(ban)作為印(yin)制(zhi)電(dian)路(lu)板(ban)(ban)制(zhi)造中(zhong)的(de)基板(ban)(ban)材料，對(dui)印(yin)制(zhi)電(dian)路(lu)板(ban)(ban)主要起互連導通、絕緣(yuan)和(he)支(zhi)撐(cheng)的(de)作用(yong)，對(dui)電(dian)路(lu)中(zhong)信(xin)號的(de)傳輸速(su)度、能量(liang)損(sun)失和(he)特性(xing)阻抗等有很大的(de)影響，因此，印(yin)制(zhi)電(dian)路(lu)板(ban)(ban)的(de)性(xing)能、品質、制(zhi)造中(zhong)的(de)加工性(xing)、制(zhi)造水平、制(zhi)造成本(ben)以及(ji)長(chang)期的(de)可(ke)靠性(xing)及(ji)穩定性(xing)在很大程度上取決(jue)于覆銅板(ban)(ban)。

二、覆銅板和pcb板的區別

PCB也就是印制電路板，別(bie)稱印刷線路板，PCB是電子(zi)(zi)元(yuan)器(qi)(qi)件(jian)的支撐(cheng)體(ti)(ti)，同時PCB也是電子(zi)(zi)元(yuan)器(qi)(qi)件(jian)電氣連接(jie)的載體(ti)(ti)。PCB能夠提供各元(yuan)器(qi)(qi)件(jian)固定裝配械支撐(cheng)，實(shi)現電子(zi)(zi)元(yuan)器(qi)(qi)件(jian)之間的布線、電氣連接(jie)和電絕緣。

覆銅(tong)(tong)板(ban)(ban)全名覆銅(tong)(tong)箔(bo)層壓板(ban)(ban)，簡(jian)稱為CCL。覆銅(tong)(tong)板(ban)(ban)是在(zai)印(yin)制電路板(ban)(ban)制造中的(de)(de)基板(ban)(ban)材料，PCB的(de)(de)各項性能在(zai)很大程度(du)上取(qu)決于覆銅(tong)(tong)板(ban)(ban)。

PCB并不是覆銅板。品牌覆銅板是在膠質板(ban)的(de)(de)(de)一(yi)面(mian)或(huo)者(zhe)雙(shuang)面(mian)覆有銅(tong)(tong)箔(bo)的(de)(de)(de)板(ban)材，覆銅(tong)(tong)板(ban)是制作(zuo)單面(mian)或(huo)者(zhe)雙(shuang)面(mian)PCB的(de)(de)(de)材料。PCB是將電(dian)路(lu)的(de)(de)(de)布局布線圖印制在覆銅(tong)(tong)板(ban)上(shang)，然后經過各(ge)種(zhong)工(gong)藝后的(de)(de)(de)電(dian)路(lu)板(ban)。

值(zhi)得一提(ti)的是(shi)，PCB除了單(dan)面(mian)和雙面(mian)之外，還有4層(ceng)、6層(ceng)、8層(ceng)、10層(ceng)的。